deep охide isolation

1) ізоляція 2) рідк. ізолююча область - air-охide isolation
- base-diffusion isolation
- ceramic isolation
- collector-diffusion isolation
- deep охide isolation
- deep trench isolation
- device isolation
- dielectric isolation
- diffused-junctionisolation
- diffusedisolation
- diode-typeisolation
- diodeisolation
- double-polysiliconisolation
- double-polyisolation
- epitaxial isolation
- etch-out and backfill isolation
- fully-enclosed air isolation
- glass isolation
- groove isolation
- half-sunk isolation
- interdevice isolation
- ion-implanted охide isolation
- isoplanar isolation
- junction isolation
- lateral isolation
- local-охide isolation
- mesa isolation
- oxide isolation
- passive isolation
- p-i-n isolation
- polycrystal isolation
- post fabrication isolation
- proton bombardment isolation
- proton isolation
- recessed dielectric isolation
- resistive isolation
- reverse-biased junction isolation
- reverse-biased isolation
- semirecessed oxide isolation
- sidewall masked isolation
- source-drain isolation
- standard buried collector isolation
- V-groove isolation

1. ім. 2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process

область; зона; ділянка (див. т-ж area, zone) - active TEG GaInAs region
- alloyed region
- avalanche region
- barrier region
- border region
- boundary region
- breakdown region
- buried region
- channel region
- channel stopреr region
- channel stop region
- charge-transfer region
- collector region
- conduction region
- conductor region
- cutoff region
- deep-UV region
- degenerate region
- depletion mode region
- depletion region
- deuterons implanted region
- diffusion-isolated region
- drain region
- drift region
- D-well region
- encroaching region
- enhanced region
- epitaxial region
- exposed region
- extrinsic region
- field region
- floating region
- forbidden region
- gate region
- graded region
- heavily-doped region
- high-conductivity region
- high-impurity region
- high-resistivity region
- hydrogenated region
- impurity region
- inactive region
- infrared region
- injection region
- injector region
- inset region
- insulation region
- insulator region
- interface region
- intrinsic region
- ion-implanted region
- island region
- isolation region
- junction region
- low-impurity region
- low-resistivity region
- multiplication region
- n region
- narrow-gap region
- near-UV region
- n-tab region
- ohmic contact region
- p region
- peripheral region
- periphery region
- polysilicon-on-охide region
- proton-damaged region
- proton implanted region
- reach-through region
- recessed охide region
- recombination region
- self-aligned regions
- shallow region
- shield region
- silicon-sapphire interface region
- softening region
- source region
- spreading-resistance region
- stack regions
- stepped-doping region
- storage region
- strip-like region
- strip-shaped region
- Strongly n-type region
- subcollector region
- subthreshold region
- superlattice region
- tank region
- terminating region
- thermally grown охide region
- transfer region
- transit-time region
- ultraviolet region
- V-groove region
- weak inversion region
- well region
- wide-gap region

1. ім. 2. дієсл. маскувати - artwork mask
- base-region mask
- base mask
- base-resistor mask
- bimetal mask
- blocking mask
- chrome mask
- collector mask
- composite mask
- contact-area mask
- contact mask
- contact-print additional mask
- custom mask
- deep UV mask
- delineation mask
- deposition mask
- diffusion mask
- doping mask
- dry film solder mask
- E-beam mask
- E-chrome mask
- electron-beam generated mask
- emitter mask
- emulsion mask
- etch ing mask
- etch mask
- etch-resistantmask
- etch-resistmask
- evaporation mask
- exposure mask
- fault injection mask
- faultless mask
- field-oxidemask
- fieldmask
- fine-line mask
- gold mask
- grid mask
- hard-surface mask
- high-contrast X-ray mask
- high-flatness mask
- high-transmission X-ray mask
- IC mask
- in situ mask
- insulator mask
- interconnection mask
- ion-beam stencil mask
- ion-implantation mask
- iron-oxide mask
- isolation mask
- layered mask
- lithographic mask
- master mask
- metal mask
- metal etched mask
- metallization etching mask
- metal-on-glass mask
- metal-on-polymer mask
- moving mask
- multi-pinhole mask
- native охide mask
- negative mask
- nonerodible mask
- offset mask
- optical mask
- optical gate mask
- overlaid mask
- oxidation mask
- oxygen-impermeable mask
- pattern mask
- pattern transfer mask
- photolithographic mask
- photoresist mask
- plating mask
- production mask
- programmingmask
- programmask
- projection mask
- p-well mask
- quartz mask
- refractory mask
- resistor-body mask
- reticle mask
- self-aligned mask
- sputter mask
- stencil mask
- step-and-repeat mask
- thick-film screen mask
- thin-film mask
- trench mask
- vacuum-deposition mask
- work mask
- X-ray lithography mask
- X-ray mask
- 1x mask
- 1:1 mask